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HA13173H
Multiple Voltage Regulator for Car Audio
REJ03F0226-0100 Rev.1.00 Jan 16, 2007
Description
The HA13173H is a multiple voltage regulator for car audio system. This IC has 5.0 V output for a microcontroller, 3.3 V output for a Digital Signal Processor, 8.0 V output for CD driver, 8.4 V output for audio control, 8.4 V output for illuminations, and high side switch output for external output. The HA13173H also has FREG that is possible to control external PNP transistor. It is adjustable output voltage by changing an external resistor.
Functions
* * * * * * * Standby current is 100 A max. The Vdd output for microcontroller has backup function, by independent power supply line. Low saturation output (PNP output) used for audio output. Output current limit circuit to avoid device destruction caused by shorted output, etc. High surge input protector against VB and VBUP. Built in a thermal shutdown circuit to prevent against the thermal destruction. The package is PRSS0015DA-C (SP-15TGV).
Rev.1.00 Jan 16, 2007 page 1 of 23
HA13173H
Pin Description
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Protection Pin Name GND FREG_B FREG_F ILM OUT CTL4 CD OUT DSP OUT VB CTL3 AUDIO OUT CTL1 EXT OUT CTL2 VDD OUT VBUP Ground External transistor bias operation FREG feed back terminal 8.4 V output for ILM/500 mA max FREG control terminal 8.0 V output for CD/1.3 A max 3.3 V output for DSP/250 mA max Battery ILM control terminal 8.4 V output for AUDIO/500 mA max DSP, CD, AUDIO control terminal High side output/600 mA max EXT control terminal 5.0 V output for microcontroller Back up Specification Normal -- On/Off On/Off On/Off -- On/Off On/Off -- -- On/Off -- On/Off -- On -- TSD ON -- On/Off On/Off Off -- Off Off -- -- Off -- Off -- On -- VB = 24 V -- Off Off Off -- Off Off -- -- Off -- Off -- On -- VB = 50 V -- Off Off Off -- Off Off -- -- Off -- Off -- Off --
Rev.1.00 Jan 16, 2007 page 2 of 23
HA13173H
Equivalent Circuit
VB 5 k Pin 2 (FREG_B) 100
Pin 3 (FREG_F)
10 k
VB
VB
Pin 4 (ILMOUT) 71 k 13 k 67 k 13 k
Pin 6 (CDOUT)
VB
VB
Pin 10 (AUDIOOUT) 71 k 13 k 20 k 13 k
Pin 7 (DSPOUT)
VB
10 k 90 k 100 k 30 k
Pin 12 (EXTOUT) 94 k 6 k
Pin 5 (CTL4) Pin 9 (CTL43) Pin 13 (CTL2)
VBUP
10 k 90 k 90 k 75 k 30 k 30 k
Pin 14 (VDDOUT) 37 k 15 k
Pin 11 (CTL1)
Rev.1.00 Jan 16, 2007 page 3 of 23
HA13173H
Timing Chart
Load dump 21 V VB 0V 26 V VBUP 5.5 V 0V 5V VDDOUT L H M L = CBUP x 300
CTL1
8.4 V AUDIOOUT 0V 3.3 V DSPOUT 0V 8.0 V CDOUT 0V H CTL2 L VB EXTOUT 0V H CTL3 L
8.4 V ILMOUT 0V
CTL4 Variable FREG (VOUT) 0V Limiter FREG_B (IB) 0A
to maximum current, because impossible to sense saturation of external Trs.
Rev.1.00 Jan 16, 2007 page 4 of 23
HA13173H
Block Diagram
DBUP VB + - CTL1 3.5 V 11 1.5 V CTL2 13 2.5 V CTL3 9 2.5 V CTL4 5 2.5 V + - + - + - + - BIAS TSD C2 0.1 F Over voltage detect 15 VBUP + CBUP 100 F +B + C1 100 F
8
VREF - + 14 VDD OUT + CVDD 10 F
- + 7 - +
DSP OUT + CDSP 10 F
DEXT1
EXT OUT + CEXT 10 F
12 VREF + - 6 + - 4 - + 10 - + 3 FREG_F GND 1 GND TAB VREF
DEXT2
CD OUT CCD 0.1 F
ILM OUT CILM 0.1 F
AUDIO OUT + CAUDIO 10 F
FREG_B QFREG RFREG3 CFREG 10 F + RFREG1 2
RFREG2 Note: TAB (header of IC) connected to GND.
Rev.1.00 Jan 16, 2007 page 5 of 23
HA13173H
External Parts Lineup
Parts No. C1 Range of Recommended Upper 100 F Operation with Different Value from the Range of Recommended Value More than the Range -- Less than the Range Unstable Lower ripple rejection ratio Unstable Unstable Unstable Unstable
Function Bypass capacitor
C2 CBUP CCD CILM CVDD CDSP CAUDIO CFREG CEXT DBUP DEXT1 DEXT2
To prevent oscillation B backup capacitor To prevent oscillation To prevent oscillation
0.1 F 0.1 to 1000 F 0.1 to 1000 F 0.1 to 470 F
Stability improve Backup time becomes long Unconfirmed Unconfirmed
Protection against mistake in joining. Terminal protection for short circuit to +B when VCC terminal is open and for short circuit to GND when GND terminal is open. We recommend Schottky barrier diodes. Output voltage = (1 + RFREG1/RFREG2) x 1.26 V Resistance for limiting base current of PNP transistor Output PNP transistor for FREG (We recommend Renesas 2SB857.)
IF 200 mA IF 1 A
Be careful of the maximum rating -- Be careful of the maximum rating. The ability to protect terminal lower. And there is some possibility of destruction. Unstable
RFREG1 RFREG2 GFREG3 QFREG
Loss of current increases Choose resistance by a required output current value and hFE of PNP transistor hFE = 50 to 200 Choose resistance by a required output current value and hFE of PNP transistor Unstable Lower output current capability
100 to 10 k
Notes: 1. We recommend Polyester film capacitor. To improve stability, take notes of the below precautions. (1) Use capacitor that is temperature independent. (2) Use capacitor that is bias voltage independent. (3) In order to bypass high frequency noise efficiently, mount the capacitor as close as possible to the VCC and GND of IC to eliminate PCB pattern inductance. 2. For using of the lower limit of recommended value, take notes of the below precautions. (1) Use capacitor that is temperature independent. (2) Use capacitor that is bias voltage independent. (3) To eliminate PCB pattern inductance mount the capacitor as close as possible to the output pin and GND of IC. 3. To improve stability, take notes of the below precautions. (1) Use capacitor that is temperature independent. (2) Use capacitor that is bias voltage independent. (3) ESR needs to be less than 10 in all the temperature ranges to be used. (4) To eliminate PCB pattern inductance mount the capacitor as close as possible to the output pin and GND of IC.
Rev.1.00 Jan 16, 2007 page 6 of 23
HA13173H
Absolute Maximum Ratings
(Ta = 25C)
Item Operating power supply voltage 1 Operating power supply voltage 2 Peak voltage Power dissipation Junction temperature Operating temperature Storage temperature Symbol Vcc1 Vcc2 Vcc(PEAK) Pd Tj Topr Tstg Rating 19 24 50 36 150 -40 to +85 -55 to +125 Unit V V V W C C C Note 1 2 3
Notes: Recommended power supply voltage range 10 to 16 V. 1. Applied time is less than 60 s. 2. Surge pulse as input. 3. Ta = 25C. : Permissible power dissipation when using a heat sink of infinite area. Refer to the derating curves below.
20
Power dissipation Pd (W)
15 thin = 1.6 mm, 100 cm Aluminum heat sink 11.0 W 10 8.7 W thin = 1.6 mm, 50 cm Aluminum heat sink
5
1.8 W 0 0 25
w/o heat sink 50 75 100 125 150 175
Ambient temperature Ta (C)
Rev.1.00 Jan 16, 2007 page 7 of 23
HA13173H
Electrical Characteristics
Item Standby current CTL1 L level (DSP, AUDIO, CD OFF) CTL1 M level (DSP, AUDIO ON, CD OFF) CTL1 H level (DSP, AUDIO, CD ON) CTL2 L level (EXT OFF) CTL2 H level (EXT ON) CTL3 L level (ILM OFF) CTL3 H level (ILM ON) CTL4 L level (FREG OFF) CTL4 H level (FREG ON) VDD OUT Output voltage Voltage regulation Load regulation Minimum I/O voltage differential Output current capacity Ripple rejection ratio CD OUT Output voltage Voltage regulation Load regulation Minimum I/O voltage differential Output current capacity Ripple rejection ratio AUDIO OUT Output voltage Voltage regulation Load regulation Minimum I/O voltage differential Output current capacity Ripple rejection ratio DSP OUT Output voltage Voltage regulation Load regulation Output current capacity Ripple rejection ratio ILM OUT Output voltage Voltage regulation Load regulation Minimum I/O voltage differential Output current capacity Ripple rejection ratio EXT OUT FREG OUT Minimum I/O voltage differential Output current capacity FREG_F Output voltage FREG_F Voltage regulation FREG_F Load regulation FREG_B Output current capacity FREG_F input bias current Symbol IST VC1L VC1M VC1H VC2L VC2H VC3L VC3H VC4L VC4H Vo1 Vo11 Vo12 Vo13 Io1 SVR1 Vo2 Vo21 Vo22 Vo23 Io2 SVR2 Vo3 Vo31 Vo32 Vo33 Io3 SVR3 Vo4 Vo41 Vo42 Io4 SVR4 Vo5 Vo51 Vo52 Vo53 Io5 SVR5 Vo61 Io6 VFF7 VFF71 VFF72 IFB7 IFF7 Min -- 0.0 2.0 4.0 0.0 3.0 0.0 3.0 0.0 3.0 4.75 -- -- -- 200 45 7.6 -- -- -- 1.3 40 8.1 -- -- -- 500 45 3.1 -- -- 250 45 8.0 -- -- -- 500 40 -- 600 1.20 -- -- 35 -- Typ 65 -- -- -- -- -- -- -- -- -- 5.00 10 50 0.4 400 55 8.0 40 70 1.0 2.0 50 8.4 30 100 0.4 850 50 3.3 40 50 500 55 8.4 40 70 1.0 900 50 0.6 900 1.26 10 10 50 50 Max 100 1.0 3.0 6.0 2.0 6.0 2.0 6.0 2.0 6.0 5.25 50 100 0.9 -- -- 8.4 100 150 1.5 -- -- 8.7 90 200 0.9 -- -- 3.5 100 100 -- -- 8.8 100 150 1.3 -- -- 1.0 -- 1.32 25 25 80 300 Unit A V V V V V V V V V V mV mV V mA dB V mV mV V mA dB V mV mV V mA dB V mV mV mA dB V mV mV V mA dB V mA V mV mV mA nA Io1 = 160 mA Vcc = 10 to 16 V, Io1 = 160 mA Io1 = 0 to 160 mA Io1 = 160 mA Vo1 4.75 V f = 100 Hz, Io1 = 160 mA Io2 = 1.0 A Vcc = 10 to 16V, Io2 = 1.0 A Io2 = 10m to 1.0 A Io2 = 1.0 A Vo2 7.6 V f = 100 Hz, Io2 = 1.0 A Io3 = 400 mA Vcc = 10 to 16 V, Io3 = 400 mA Io3 = 10 to 400 mA Io3 = 400 mA Vo3 8.1 V f = 100 Hz, Io3 = 400 mA Io4 = 200 mA Vcc = 10 to 16 V, Io4 = 200 mA Io4 = 0 to 200 mA Vo4 3.1 V f = 100 Hz, Io4 = 200 mA Io5 = 400 mA Vcc = 10 to 16 V, Io5 = 400 mA Io5 = 10 to 400 mA Io5 = 400 mA Vo5 8.0 V f = 100 Hz, Io5 = 400 mA Vcc = 10 to 16 V, Io6 = 480 mA Vo61 1.0 V Iload (external PNP) = 400 mA Vcc = 10 to 16 V, Iload = 400 mA Iload = 10 to 400 mA VFF 1.20 V Test Condition CTL1, 2, 3, 4 = 0 V
Rev.1.00 Jan 16, 2007 page 8 of 23
HA13173H
Evaluation Circuit
HA13173H
ILM GND FREG_B FREG_F OUT 1 2 3 4 CD OUT 6 DSP OUT 7 AUDIO OUT CTL1 10 11 CAUDIO + 10 F RL3 Io3 RL6 Io6 EXT OUT 12 VDD OUT 14
CTL4 5
VB 8
CTL3 9
CTL2 13
VBUP 15
CILM IFB7 IFF7 RL5 QFREG 2SB857 Io5 0.1 F RL2 Io2
CCD
CDSP + 0.1 10 F F
CEXT + 10 F RL1 Io1
CVDD + 10 F
RL4 Io4
FREG CFREG1 10 F + RFREG1 1.6 k RFREG2 1 k
ILM RL7
CD
DSP
AUDIO
EXT
VDD
SW4 Iload SW3 SW2 SW5 ON C1 100 F + C2 0.1 F SW1 OFF R1 200 k
CTL4
VB
CTL3
CTL1
CTL2
Rev.1.00 Jan 16, 2007 page 9 of 23
HA13173H
Main Characteristics
Standby Current vs. Tc 100 VB = 14.4 V, 90 CTL1,2,3,4 = 0 V 80 70 60
Ist (A)
50 40 30 20 10 0 -50
0
50 Tc (C)
100
150
200
CTL-Vth vs. Tc 4.0
3.5
3.0
2.5
Vo (V)
2.0
1.5
1.0 CTL1(M) CTL1(H) CTL2 CTL3 CTL4 0 50 Tc (C) 100 150
0.5
0 -50
Rev.1.00 Jan 16, 2007 page 10 of 23
HA13173H
VDD Output Voltage vs. Tc 5.25 VB = 14.4 V, 5.20 Io = 160 mA 5.15 5.10 5.05
Vo (V)
5.00 4.95 4.90 4.85 4.80 4.75 -50
0
50 Tc (C) CD Output Voltage vs. Tc
100
150
8.4 VB = 14.4 V, Io = 1.0 A 8.3
8.2
8.1
Vo (V)
8.0
7.9
7.8
7.7
7.6 -50
0
50 Tc (C)
100
150
Rev.1.00 Jan 16, 2007 page 11 of 23
HA13173H
Audio Output Voltage vs. Tc 8.7 VB = 14.4 V, Io = 400 mA 8.6
8.5
Vo (V)
8.4
8.3
8.2
8.1 -50
0
50 Tc (C) DSP Output Voltage vs. Tc
100
150
3.50 VB = 14.4 V, Io = 200 mA 3.45
3.40
3.35
Vo (V)
3.30
3.25
3.20
3.15
3.10 -50
0
50 Tc (C)
100
150
Rev.1.00 Jan 16, 2007 page 12 of 23
HA13173H
ILM Output Voltage vs. Tc 8.8 VB = 14.4 V, Io = 400 mA 8.7
8.6
8.5
Vo (V)
8.4
8.3
8.2
8.1
8.0 -50
0
50 Tc (C)
100
150
EXT Output Remainder Voltage vs. Tc 1.0 VB = 14.4 V, Io = 480 mA 0.8
0.6
Vo (V)
0.4
0.2
0 -50
0
50 Tc (C)
100
150
Rev.1.00 Jan 16, 2007 page 13 of 23
HA13173H
FREG_F Terminal Voltage vs. Tc 1.32 VB = 14.4 V
1.30
1.28
Vo (V)
1.26
1.24
1.22
1.20 -50
0
50 Tc (C) SVR vs. Tc
100
150
65 VB = 14.4 V, vrip = 0 dBm, frip = 100 Hz 60
55
SVR (dB)
50
45
40
VDD(0.16A) CD(1A) Audio(0.4A) DSP(0.2A) ILM(0.4A) 0 50 Tc (C) 100 150
35 -50
Rev.1.00 Jan 16, 2007 page 14 of 23
HA13173H
SVR vs. f 70 VB = 14.4 V, vrip = 0 dBm 60
50
SVR (dB)
40
30
20 VDD CD Audio DSP ILM 100 1000 f (Hz) SVR vs. Io 70 VB = 14.4 V, vrip = 0 dBm, frip = 100 Hz 65 10000 100000
10
0 10
60
SVR (dB)
55
50
45
VDD CD Audio DSP ILM 0 500 Io (mA) 1000 1500
40
Rev.1.00 Jan 16, 2007 page 15 of 23
HA13173H
Vo-Io Characteristics VDD Output 6 VB = 14.4 V
5
4
Vo (V)
3
2
1 100C 25C -40C 0 0 200 Io (mA) Vo-Io Characteristics CD Output 9 VB = 14.4 V 8 7 6 5 4 3 2 1 0 100C 25C -40C 0 1 Io (A) 2 3 400 600
Rev.1.00 Jan 16, 2007 page 16 of 23
Vo (V)
HA13173H
Vo-Io Characteristics Audio Output 9 VB = 14.4 V 8 7 6
Vo (V)
5 4 3 2 1 0 100C 25C -40C 0 500 Io (mA) Vo-Io Characteristics DSP Output 4.0 VB = 14.4 V 3.5 1000 1500
3.0
2.5
Vo (V)
2.0
1.5
1.0
0.5
100C 25C -40C 0 200 Io (mA) 400 600
0
Rev.1.00 Jan 16, 2007 page 17 of 23
HA13173H
Vo-Io Characteristics ILM Output 9 8 7 6
Vo (V)
5 4 3 2 1 VB = 14.4 V 0 0 200 400 600 800 Io (mA) 1000 100C 25C -40C 1200 1400
Vo-Io Characteristics EXT Output 16 VB = 14.4 V 14 100C 25C -40C
12
10
Vo (V)
8
6
4
2
0
0
300
600 Io (mA)
900
1200
1500
Rev.1.00 Jan 16, 2007 page 18 of 23
HA13173H
VFB-IB Characteristics FREG Output 1.4 VB = 14.4 V 1.2
1.0
VFB (V)
0.8
0.6
0.4
0.2
100C 25C -40C 0 20 40 IB (mA) 60 80
0
Rev.1.00 Jan 16, 2007 page 19 of 23
HA13173H
Handling Cautions (SP-15TGV Package)
Mounting 1. For mounting the package on the heat sink, 4 to 8 kgcm of screwing-torque is recommended; excessive torque will cause device deformation, resulting in pellet-crack, connector-lead-wire-breaking, etc., and too less torque will increase the heat resistance. 2. The use of screws needs the following cautions. 1) Use the standardized binding-head screws. 2) Ova counter-sunk screws, subjecting the IC to intense stress, must not be used. 3) To the use of tapping screws the cautions for binding torque strength must be applied. 4) Use a tapping screw diameter smaller than an IC mounting-hole.
Binding-head screw Recommended Screw
Small-head screw
Flat-head screw Unused Screws
Oval counter-sunk screws
3. In IC binding, metal-fittings striking on the plastic of the IC may cause characteristics-deterioration or packagecrack. 4. Poor flatness of heat sink sometimes prevents effective heat-sinking or subjects the IC surface to intense stress, causing characteristics-deterioration or package-crack. 1) 0.1 mm max. of heat-sink flatness error for the contact area (14.3 mm x 19.66 mm) will be tolerated. 2) Contact-surface ruggedness should be finished in grade. 3) For aluminum, copper, or iron plates, check them for no burr and mold them for screw-holes. 4) Cutting chips between the IC header and the heat sink will cause heat-sinking deterioration. 5) The heat-sink hole diameter should not exceed 4.0 mm. 5. As silicone grease, the Shin-Etsu Chemical Industry G746 is recommended. Coarse or an excessive amount of grease may cause intensive stress to the IC, when binding. 6. Do not Screw the IC on the heat sink after soldering the lead wires on the printed circuit board (PCB). If the IC is screwed after the lead wires are soldered on the PCB then characteristics of the IC may deteriorate in the cause of large strain concentrate to the lead wires because of dimension-difference of the PCB and the heat sink. 7. Do not solder of lead wires to the header of the IC on direct. If you solder direct then the IC life characteristics will deteriorate remarkably with bad-influence on the die. For the method and conditions of lead-wire forming, users are requested to contact the vendor.
Rev.1.00 Jan 16, 2007 page 20 of 23
HA13173H 8. Header of IC (TAB) have to connect to GND. For mounting the header of IC on the heat sink with the screw, heat sink have to connect to GND. When header of IC mount with heat sink with holding parishes conductive material, holding parts have to connect to GND. At this time, the holding parts mount with heat sink with the screw, or it must connect to header of IC. If users have question or request, please contact the vendor.
Example of Recommendation about the Method of Connecting Header of IC to GND Bad example
There is a crevice or the insulator is inserted.
NG
NG
NG
Header of IC and GND are not connected.
Header of IC is not connected to GND.
There is no heat sink.
9. Soldering should be done within the soldering heat test standard of the IC, specifying that the lead wires, up to 1 to 1.5 mm off the IC body, are kept in solder at 260C for 10 seconds (2 or less times) and at 350C for 3 seconds. Therefore give careful consideration in order to do not exceed the condition. In a soldering iron is used, use a soldering iron grounded and do not leak at the tip. Characteristics 1. When there may be the mode which VB, VBUP or GND, and each output reverse with a normal potential state in application, it recommends attaching a diode for IC protection. When outputting the terminal of IC to the direct set exterior, a diode is required in order to protect IC from incorrect contact on a battery and a GND line. Especially EXTOUT is required. 2. In the parts shown in external part lineup, the value of a capacitor is the minimum value required in order to secure the oscillation stability of IC. Please use the capacitor independent of temperature and bias. Moreover, please use the capacitor whose ESR is 10 or less in the operating temperature range.
Rev.1.00 Jan 16, 2007 page 21 of 23
HA13173H
Protections
1. Overvoltage protection circuit The overvoltage protection circuit (surge protector) turns off all outputs without Vdd, when VB voltage is more than about 21 V. And the overvoltage protection circuit (surge protector) turns off Vdd output with other all outputs, when VB voltage is more than about 26 V. The VB 18 V condition, the stand by current increases. 2. Overcurrent protection circuit FREG_B (pin 2), ILM OUT (pin 4), CD OUT (pin 6), DSP OUT (pin 7), AUDIO OUT (pin 10), EXT OUT (pin 12), VDD OUT (pin 14) output circuits are built-in overcurrent protection circuit, based on the respective output current. 3. Thermal protection circuit A built-in thermal protection circuit (TSD: Thermal Shut Down) prevents thermal damage to the IC. All outputs except VDD (pin 14) and FREG (pin 2, 3) are switched off when the circuit operates, revert to the original state when the temperature drops to a certain level. 4. FREG operation FREG function needs external PNP transistor, feedback resistor, stability capacitor. If the external transistor become saturation level, the base current depend on IC specification, that is FREG_B (pin 2) maximum current specification. 5. We recommend to mount a bypass diode in your application if there is a mode where potential difference between each output and VB (pin 8), VBUP (pin 15) or GND (pin 1) is reversed from the normal state. 6. Header of IC (TAB) have to connect to GND. For mounting the header of IC on the heat sink with the screw, heat sink have to connect to GND. When header of IC mount with heat sink with holding parts (use conductive material), holding parts have to connect to GND. At this time, the holding parts mount with heat sink with the screw, or it must connect to header of IC. If users have question or request, please contact the vendor. 7. Soldering should be done within the soldering heat test standard of the IC, specifying that the lead wires, up to 1 to 1.5 mm off the IC body, are kept in solder at 260C for 10 s and at 350C for 3 s. Therefore give careful consideration in order to do not exceed the condition. In a soldering iron is used, use a soldering iron grounded and do not leak at the tip. 8. To keep stability regulation The stability capacitor should be no temperature dependability and no bias voltage dependability. ESR level should be bellow 10 W all temperature range.
Rev.1.00 Jan 16, 2007 page 22 of 23
HA13173H
Package Dimensions
JEITA Package Code P-HSIP15-14.3x19.66-1.27 RENESAS Code PRSS0015DA-C Previous Code SP-15TGV MASS[Typ.] 3.0g Unit : mm
20.5 MAX 19.66 19.0
0.3
3.3MiN 3.6
0.2
3.5 TYP 3.8MAX
2-C3.0
0.2
1.1MiN 1.28 TYP 1.50MAX
11.3 0.3
3.0
0.2
7.8
13.8
0.25
*1
+0.10 -0.05
1.110.25
0.6
0.1
1.27
0.25
*1
2.54
0.25
1.8 0.25 3.5
0.5
*1
6.04
0.5 *1
Note) 1. Dimension "*1" is the value after bending.
( Ni/Pd/Au plating )
Rev.1.00 Jan 16, 2007 page 23 of 23
17.9
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Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2007. Renesas Technology Corp., All rights reserved. Printed in Japan.
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